AI Industry Chain Panorama¶
📊 Read This Page Before Atlas
This page is an introductory overview (60+ tickers × hand-curated 30 key edges). After reading, proceed to the advanced 🆕 Industry Chain Atlas — LLM-mined from 1643 SemiAnalysis + Stratechery articles, yielding 269 edges with ≥2 citations, including specific what flows + citation counts.
The AI industry is like a pyramid: at the top are AI labs like OpenAI/Anthropic, below them cloud providers offering compute, compute relies on NVIDIA GPUs, GPUs are manufactured by TSMC, TSMC uses ASML lithography machines, and ASML uses various lasers and components...
The diagram below shows the relationships among the 60+ tickers we track (edges with importance ≥ 0.7):
Simplified Industry Chain Diagram¶
graph LR
%% Upstream
ASML[ASML Lithography] --> TSM[TSM/Samsung Foundry]
AMAT[AMAT/LRCX Equipment] --> TSM
SNPS[SNPS/CDNS EDA] --> NVDA[NVDA/AMD/AVGO Chip Design]
%% Memory
SKHynix[SK Hynix HBM] --> NVDA
MU[Micron HBM] --> NVDA
%% Manufacturing
TSM --> NVDA
%% Network/Optical
COHR[COHR/LITE Optical Modules] --> NVDA
ANET[ANET Network Switches] --> Hyperscaler
%% Cloud
NVDA --> Hyperscaler[MSFT/GOOGL/AMZN Cloud]
NVDA --> CRWV[CRWV/NBIS Neocloud]
%% AI Labs
Hyperscaler --> OpenAI[OpenAI]
Hyperscaler --> Anthropic[Anthropic]
CRWV --> OpenAI
%% Supporting
CEG[CEG/VST Power] --> Hyperscaler
VRT[VRT/ETN/HUBB Electrical Infrastructure] --> Hyperscaler
classDef upstream fill:#fef3c7,stroke:#d97706
classDef midstream fill:#dbeafe,stroke:#2563eb
classDef downstream fill:#dcfce7,stroke:#16a34a
classDef support fill:#fce7f3,stroke:#db2777
class ASML,AMAT,SNPS,TSM,SKHynix,MU upstream
class NVDA,COHR,ANET midstream
class Hyperscaler,CRWV,OpenAI,Anthropic downstream
class CEG,VRT support
Layer Details (Relationships with importance ≥ 0.7)¶
Upstream (Equipment/Materials/Wafer/Memory)¶
31 relationships
| Upstream | Relationship | Downstream | Importance | Description |
|---|---|---|---|---|
| SNPS | EDA Design Tools | NVDA | 0.9 | Synopsys EDA tools for all NVDA chip design. |
| CDNS | EDA Design Tools | NVDA | 0.9 | Cadence EDA tools for NVDA + most chip designers. |
| SNPS | EDA Design Tools | AMD | 0.8 | Synopsys for AMD. |
| CDNS | EDA Design Tools | AMD | 0.8 | Cadence for AMD. |
| SNPS | EDA Design Tools | AVGO | 0.8 | Synopsys for Broadcom. |
| CDNS | EDA Design Tools | AVGO | 0.8 | Cadence for Broadcom. |
| TSM | Wafer Foundry | NVDA | 1.0 | TSMC manufactures all NVDA datacenter GPUs (Hopper, Blackwell, Vera Rubin) on 4N/3N/2N nodes. NVDA i |
| TSM | Wafer Foundry | AAPL | 1.0 | TSMC manufactures all Apple A/M-series silicon. |
| TSM | Wafer Foundry | AMD | 0.9 | TSMC manufactures AMD EPYC + MI300 datacenter chips. |
| TSM | Wafer Foundry | AVGO | 0.9 | TSMC manufactures AVGO Google TPU + custom silicon. |
| TSM | Wafer Foundry | MRVL | 0.8 | TSMC manufactures Marvell DPU + custom AI silicon. |
| TSM | Wafer Foundry | QCOM | 0.8 | TSMC manufactures Qualcomm Snapdragon. |
| 0981.HK | Wafer Foundry | BIDU | 0.8 | SMIC manufactures Baidu Kunlun AI chips (China domestic). |
| TSM | Wafer Foundry | META | 0.7 | TSMC manufactures Meta MTIA custom AI silicon. |
| TSM | Wafer Foundry | MSFT | 0.7 | TSMC manufactures Microsoft Maia 100 AI accelerator. |
| TSM | Wafer Foundry | AMZN | 0.7 | TSMC manufactures AWS Trainium2 + Inferentia (some are also Samsung). |
| ASML | Lithography / Equipment | TSM | 1.0 | ASML is sole supplier of EUV lithography to TSMC. Bottleneck for 3nm/2nm ramp. |
| ASML | Lithography / Equipment | 005930.KS | 0.9 | ASML EUV to Samsung Foundry. |
| ASML | Lithography / Equipment | INTC | 0.8 | ASML EUV to Intel Foundry. |
| ASML | Lithography / Equipment | MU | 0.8 | ASML for DRAM/HBM lithography. |
| ASML | Lithography / Equipment | 000660.KS | 0.8 | ASML for SK Hynix DRAM/HBM. |
| AMAT | Lithography / Equipment | TSM | 0.7 | Applied Materials supplies deposition + etch tools to all foundries. |
| AMAT | Lithography / Equipment | MU | 0.7 | AMAT tools to Micron DRAM/NAND. |
| LRCX | Lithography / Equipment | TSM | 0.7 | Lam Research supplies etch + deposition to all foundries. |
| LRCX | Lithography / Equipment | MU | 0.7 | Lam Research to Micron. |
| 000660.KS | High Bandwidth Memory HBM | NVDA | 1.0 | SK Hynix is dominant HBM3e supplier to NVDA H100/H200/B100. ~60% market share. |
| 000660.KS | High Bandwidth Memory HBM | AMD | 0.9 | SK Hynix HBM3e supplier to AMD MI300. |
| MU | High Bandwidth Memory HBM | NVDA | 0.8 | Micron ramped HBM3e in 2024, gaining share with NVDA Blackwell. |
| 000660.KS | High Bandwidth Memory HBM | AVGO | 0.8 | SK Hynix HBM supplier to Google TPU (via AVGO). |
| 005930.KS | High Bandwidth Memory HBM | NVDA | 0.7 | Samsung Electronics HBM3e gradually qualified by NVDA (slower than Hynix). |
| MU | High Bandwidth Memory HBM | AMD | 0.7 | Micron HBM3e supplier to AMD MI300 (smaller share). |
Midstream (Design/Network/Optical Modules)¶
9 relationships
| Upstream | Relationship | Downstream | Importance | Description |
|---|---|---|---|---|
| ANET | Network Switches | META | 0.9 | Arista is Meta's primary network supplier. |
| AVGO | Network Switches | GOOGL | 0.9 | Broadcom is Google's primary custom networking + TPU silicon partner. |
| ANET | Network Switches | MSFT | 0.8 | Arista Networks switches for hyperscaler AI fabrics. |
| MRVL | Network Switches | AMZN | 0.8 | Marvell DPU + custom silicon for AWS Trainium2. |
| AVGO | Network Switches | META | 0.7 | Broadcom custom silicon (MTIA) to Meta. |
| COHR | Optical Modules / Optical Communication | NVDA | 0.9 | Coherent supplies optical transceivers for NVDA Spectrum-X networking. NVDA $2B strategic equity inv |
| LITE | Optical Modules / Optical Communication | NVDA | 0.8 | Lumentum supplies optical chips. NVDA $2B strategic investment. |
| AAOI | Optical Modules / Optical Communication | NVDA | 0.7 | Applied Optoelectronics supplies optical transceivers. |
| 300308.SZ | Optical Modules / Optical Communication | NVDA | 0.7 | Innolight is dominant Chinese optical transceiver supplier. |
Downstream (Cloud/AI Labs/Customers)¶
12 relationships
| Upstream | Relationship | Downstream | Importance | Description |
|---|---|---|---|---|
| MSFT | Cloud Customer Relationship | OPENAI | 1.0 | Microsoft Azure is OpenAI's primary compute (since 2019, exclusive until 2024). |
| AMZN | Cloud Customer Relationship | ANTH | 0.9 | AWS provides primary compute to Anthropic ($100B+ deal). |
| MSFT | Cloud Customer Relationship | ANTH | 0.7 | Microsoft Azure provides compute to Anthropic (after 2024-Q4 multi-year deal). |
| GOOGL | Cloud Customer Relationship | ANTH | 0.7 | Google Cloud also provides compute to Anthropic (multi-cloud). |
| NVDA | GPU → AI Labs | MSFT | 0.9 | NVDA GPUs power Microsoft Azure AI + OpenAI compute. |
| NVDA | GPU → AI Labs | CRWV | 0.9 | CoreWeave is largest NVDA GPU customer outside hyperscalers ($100B backlog). |
| NVDA | GPU → AI Labs | META | 0.9 | Meta is one of NVDA's largest customers (Llama 3 training on 16K H100). |
| NVDA | GPU → AI Labs | NBIS | 0.9 | Nebius (formerly Yandex) NVDA GPU customer, alternative neocloud. |
| NVDA | GPU → AI Labs | ORCL | 0.8 | Oracle Cloud massive NVDA GPU buildout for OpenAI compute (Stargate). |
| NVDA | GPU → AI Labs | AMZN | 0.8 | AWS offers NVDA GPUs (alongside Trainium2 alternative). |
| NVDA | GPU → AI Labs | ANTH | 0.8 | Anthropic uses NVDA GPUs for Claude training. |
| NVDA | GPU → AI Labs | GOOGL | 0.7 | NVDA GPUs in Google Cloud (alongside TPU). |
Supporting (Data Centers/Power/Cooling)¶
13 relationships
| Upstream | Relationship | Downstream | Importance | Description |
|---|---|---|---|---|
| VRT | Data Center Infrastructure | CRWV | 0.9 | Vertiv to CoreWeave (neocloud). |
| VRT | Data Center Infrastructure | MSFT | 0.8 | Vertiv power + cooling infrastructure for MSFT datacenters. |
| VRT | Data Center Infrastructure | GOOGL | 0.8 | Vertiv to Google datacenters. |
| VRT | Data Center Infrastructure | AMZN | 0.8 | Vertiv to AWS datacenters. |
| VRT | Data Center Infrastructure | META | 0.8 | Vertiv to Meta datacenters. |
| VRT | Data Center Infrastructure | NBIS | 0.8 | Vertiv to Nebius. |
| ETN | Data Center Infrastructure | MSFT | 0.8 | Eaton power distribution for hyperscaler datacenters. |
| ETN | Data Center Infrastructure | GOOGL | 0.8 | Eaton for Google. |
| ETN | Data Center Infrastructure | AMZN | 0.8 | Eaton for AWS. |
| HUBB | Data Center Infrastructure | MSFT | 0.7 | Hubbell electrical for hyperscalers. |
| CEG | Power | MSFT | 0.8 | Constellation Energy 20-year PPA with Microsoft for nuclear power (Three Mile Island reopening). Cri |
| VST | Power | MSFT | 0.7 | Vistra power supply to hyperscalers. |
| CEG | Power | AMZN | 0.7 | Constellation power. |
Key Takeaways (5 Things)¶
-
NVIDIA is not isolated — It depends on TSMC for foundry, SK Hynix for HBM memory, Coherent/Lumentum for optical modules, and Synopsys/Cadence for design software. Any disruption in one link affects NVDA.
-
AI labs are not direct customers — OpenAI buys compute from Microsoft Azure, and Microsoft then buys GPUs from NVIDIA. So in NVDA's earnings, "hyperscaler capex" is key, not "OpenAI revenue."
-
CoreWeave is a "Neocloud" — Unlike hyperscalers, it only rents AI compute (no general cloud), with highly concentrated customers (MSFT accounts for 60%+), and has an equity relationship with NVIDIA ($36B equity).
-
Power is the real bottleneck — AI data centers consume enormous electricity, involving not just hardware but also "picks and shovels" like Constellation Energy (nuclear PPA), Vistra, Eaton, and Vertiv.
-
The industry chain transmits upstream and downstream — Samsung strike → HBM shortage → NVDA shipments affected → customers queue. Learn to track upstream + downstream for a complete view on any single stock.