🐂 TSM — Company Profile (Teaching)¶
Teaching site, not investment advice. Specific market cap / stock price / financial figures change frequently and are intentionally omitted; use the SEC + Yahoo Finance links below to pull real-time data yourself.
📌 Basics¶
| Dimension | Content | Source |
|---|---|---|
| Core business | World's largest pure-play foundry (no in-house products) — 3nm / 5nm / 7nm advanced nodes + CoWoS advanced packaging — serves NVDA / AMD / AAPL / GOOGL / AVGO / MRVL / nearly the entire industry | 20-F FY25 |
| Founded / HQ | 1987 / Hsinchu Science Park, Taiwan | wiki |
| CEO | C.C. Wei (CEO since 2018/06; became Chairman & CEO 2024/06, succeeding Mark Liu in the Chairman role) | Company announcement |
| Primary listing | Dual-listed: NYSE ADR (TSM, 1 ADR = 5 common shares) + Taiwan Stock Exchange (2330.TW) |
— |
| Foreign filer | Yes (Taiwan company; files 20-F with SEC, not US 10-K) | SEC |
| Fiscal year | Calendar year (Jan 1 – Dec 31) | — |
💡 Real-time market cap / share price / per-node revenue mix: see SEC primary + IR links below.
ADR ratio note: TSM 1 ADR = 5 Taiwan shares — must distinguish when computing market cap (verify_facts.sh v3 has a known gap on ADR ratio — see LEDGER note).
🏭 Supply Chain Coordinates (Part 1-C6 framework)¶
Upstream (Who TSM Depends On)¶
| Supplier | What flows | Key dependency |
|---|---|---|
ASML |
EUV (industry-wide monopoly) + DUV lithography | Irreplaceable |
AMAT + LRCX + KLAC + TOELY |
Deposition / etch / inspection / coating equipment | Multi-vendor oligopoly |
SKH / MU / SSNLF |
HBM3E (memory placed on CoWoS) | Three-source |
SNPS + CDNS |
EDA + IP | Duopoly |
| Taiwan + US Arizona + Japan Kumamoto + Germany Dresden fab footprint | Diversified manufacturing | Strategic |
Downstream (Who Depends on TSM)¶
| Customer | Relationship | Concentration |
|---|---|---|
AAPL |
All iPhone A-series + Mac M-series SoC fabricated by TSM | #1 customer — ~25% of TSM revenue |
NVDA |
GPU full line + Blackwell + future Rubin all at TSM (incl. CoWoS packaging) | Top-5 customer, fastest growing |
AMD |
EPYC + MI + Ryzen full line | Top-5 |
GOOGL + AVGO |
All 7 generations of TPU | Critical AI customer |
QCOM + MRVL + MTK (2454.TW) + nearly all fabless |
Phone / network / embedded chips | Highly diversified tail |
INTC |
Some advanced products (Intel using TSM as backup alongside its own 18A) | New, strategic shift |
Competitors¶
- Advanced foundry (3nm and below):
SSNLFSamsung Foundry (#2 share but 3nm yield 1-2 years behind TSM);INTCFoundry (18A ramping, behind TSM by one node) - China substitutes:
SMIC(mainly 7nm DUV, restricted by ASML EUV export controls) / Huawei partnership on Ascend 910C - Mature nodes:
UMC(2303.TW, Taiwan United Microelectronics) +GFSGlobalFoundries (12nm+) — does not pursue advanced nodes
💼 Business Model + Value Capture (Part 1-C7 view)¶
- Revenue mix: Smartphone ~33% (mainly AAPL) / HPC / AI ~52%+ (NVDA / AMD / GOOGL / customer ASIC; surpassed smartphone in 2024) / IoT ~6% / Auto ~5% / Other ~4%
- Gross margin: 50%+ (advanced nodes higher GM; 2025 raised long-term GM target to 53%+)
- Pricing power: 3nm / 5nm strong; NVDA / AAPL pay a premium — extremely strong (no alternative)
- Substitution difficulty: Strongest physical-layer moat — 30 years of process accumulation + customer PDK + yield / customer base positive feedback
(For specific quarterly revenue / AI share / capex data, see the latest SEC 20-F.)
🏰 Moat Assessment (Part 3-C2 Buffett 5-step lens)¶
| Type | Strength (0-1) | Source |
|---|---|---|
| Brand | 0.8 | "TSMC" = global synonym for "foundry" |
| Switching cost | 1.0 | Customer PDK + verification + yield lock-in for 5-10 years |
| Network effects | 0.6 | Customer base → yield → more customers (positive feedback) |
| Scale + cost | 1.0 | 60%+ share of global advanced foundry; largest R&D + capex scale |
Composite: 3.4 / 4 → extremely strong moat, but Taiwan Strait geopolitics is the core reverse risk
⚠️ Key Reverse-Trigger Conditions (Part 3-C5 anti-thesis view)¶
- Trigger 1 (low probability, catastrophic): Taiwan Strait event → fab shipments interrupted 6-12+ months — full global AI chain halts (with partial relief from US / Japan / Germany fabs)
- Trigger 2 (annual): SSNLF Samsung 3nm/2nm yield catches up to TSM — partial AAPL / NVDA single-source shift
- Trigger 3 (event): INTC Foundry 18A ramp succeeds + major customers (NVDA / Qualcomm) actually tape out — long-term share risk
- Trigger 4 (quarterly): AAPL iPhone unit sales decline sharply — TSM's #1 customer revenue impacted
- Trigger 5 (low probability): SMIC + Huawei jointly breakthrough on EUV self-sufficiency — physically very difficult in 5-10 years (LEDGER F-111)
🔗 Teaching Cross-References¶
- Part 1-C5 · Hardware stack — Foundry is the physical foundation of chips
- Part 1-C6 · 5 supply chain roles — TSM is the midstream foundry leader
- Part 1-C7 · Business model — 50%+ GM physical moat
- Part 1-C9 · US-China geopolitics — Taiwan Strait + export controls + fab diversification
- Part 1-C10 · 5 real cases — DeepSeek sell-off also impacts TSM
- Patterns — #2 incumbent moat · #7 picks-and-shovels · #12 geopolitical risk
📚 SEC Primary Filings (look it up yourself)¶
- Latest 20-F (FY25 annual) — full annual data + customer concentration + geopolitical risk
- SEC EDGAR TSM all filings — 6-K quarterly + 8-K announcements
- Investor relations (English) — monthly revenue / earnings calendar
Real-time quote: Yahoo Finance TSM (ADR) / TWSE 2330.TW
Teaching use · numbers change — learn the method, not the specific figures · investment decisions are based on your own research + risk tolerance