🐂 SKH — Company Profile (Teaching)¶
Teaching site, not investment advice. Specific market cap / stock price / financial figures change frequently and are intentionally omitted; use the SEC + Yahoo Finance links below to pull real-time data yourself.
Ticker note: Korea KOSPI
000660(primary) / US OTCHXSCL(144A GDR — primary OTC quote; see OTC Markets + Bloomberg HXSCL:US). SKH used as a shorthand on this site; see table below for accurate references.
📌 Basics¶
| Dimension | Content | Source |
|---|---|---|
| Core business | DRAM (incl. HBM3E / HBM4) + NAND (Solidigm / former Intel NAND: 2021/12/29 first close, 2025/03/27 second & final close) + CMOS image sensors — global HBM primary supplier (~50%+ share) | wiki + TrendForce |
| Founded / HQ | 1983 / Icheon, Gyeonggi-do, South Korea | wiki |
| CEO | Kwak Noh-Jung (Co-CEO since 2022/03; sole CEO since 2024/03 after Park Jung-Ho stepped down to Vice Chairman) | Company announcement |
| Primary listing | Korea KOSPI: 000660 (primary) + US OTC: HXSCL (144A GDR, low liquidity) | OTC Markets HXSCL |
| SEC filings | Does not file with SEC — Korean company; financials filed with Korea's FSS DART (English summaries on company IR site) | DART |
| Fiscal year | Calendar year (Jan 1 – Dec 31) | — |
💡 Real-time market cap / share price / HBM shipments / revenue: see company IR + Yahoo links below.
🏭 Supply Chain Coordinates (Part 1-C6 framework)¶
Upstream (Who SKH Depends On)¶
| Supplier | What flows | Key dependency |
|---|---|---|
ASML |
EUV lithography tools (required for advanced DRAM/HBM manufacturing) | Only option |
AMAT + LRCX + KLAC + TOELY |
Deposition / etch / inspection / coating equipment | Multi-vendor oligopoly |
SNPS + CDNS |
EDA tools (limited use, primarily memory design) | Duopoly |
Downstream (Who Depends on SKH)¶
| Customer | Relationship | Concentration |
|---|---|---|
NVDA |
Primary HBM3E supplier (70%+ share) + HBM4 in qualification — strategic relationship | NVDA is SKH's #1 HBM customer (per media reports + industry shipment data) |
AMD |
Primary HBM3E supplier for MI300 / MI350 | #2 HBM customer |
GOOGL |
HBM3E for TPU | Critical |
INTC |
HBM supplied to Gaudi 3 / Jaguar Shores (HBM4) roadmap; Falcon Shores no longer commercialized (small share) | General |
| Global server / phone DRAM + NAND buyers | Commodity memory (legacy business, large volume but lower GM) | Diversified |
Competitors¶
- HBM:
MUMicron (#2 HBM3E supplier, ~20% share, taking NVDA #2 slot) /SSNLFSamsung (historical HBM leader; 2024 HBM3E NVDA qualification delays cost share; HBM4 catching up) - General DRAM: SSNLF Samsung / MU Micron (three-way oligopoly: SKH ~30-35% / Samsung ~40% / MU ~25%)
- NAND: SSNLF /
KIOXIA(TSE: 285A) /WDC(SNDKpost 2025/02 spinoff) /YMTC(China YMTC) - China substitutes:
CXMT(HBM3 production target end-2026)
💼 Business Model + Value Capture (Part 1-C7 view)¶
- Revenue mix: DRAM (incl. HBM3E ~high-margin core) ~60-70% / NAND (Solidigm) ~25-30% / Other (CIS etc.) ~5%
- Gross margin: Extreme cyclicality — DRAM upswing GM 50%+, downturn -10% or worse. HBM3E locked-price contracts are relatively stable and currently drive most GM
- Pricing power: HBM3E powerful after qualification (NVDA can't switch on short notice); commodity DRAM is price-taker — HBM strong / commodity weak
- Substitution difficulty: HBM medium — NVDA has qualified MU as secondary, but capacity + qualifying cycles make actual switching slow (1-2 years)
(For specific quarterly revenue / HBM revenue share / DRAM cycle, see the company IR site.)
🏰 Moat Assessment (Part 3-C2 Buffett 5-step lens)¶
| Type | Strength (0-1) | Source |
|---|---|---|
| Brand | 0.4 | B2B memory; customers respect SK Hynix quality but no mass-market recognition like NVDA |
| Switching cost | 0.6 | HBM3E qualified; switching to MU requires 1-2 year qual cycle |
| Network effects | 0.2 | Memory isn't a classic network-effects business |
| Scale + cost | 0.7 | One of three global DRAM giants; HBM leader; ASML EUV priority capacity |
Composite: 1.9 / 4 → HBM business has cyclical moat; commodity DRAM is fundamentally a cyclical stock
⚠️ Key Reverse-Trigger Conditions (Part 3-C5 anti-thesis view)¶
- Trigger 1 (quarterly): HBM3E ASP drops sharply / price war with MU — margin compression
- Trigger 2 (annual): SSNLF HBM4 qualifies on NVDA + large shipments — SKH HBM share declines
- Trigger 3 (low probability): CXMT China HBM3 production + Chinese customers switch — long-term share risk
- Trigger 4 (quarterly): NVDA capex growth slows — HBM demand cools
- Trigger 5 (cyclical): General DRAM downturn (supply glut) — historically 18-24 month cycles
🔗 Teaching Cross-References¶
- Part 1-C5 · Hardware stack — HBM is the core AI GPU performance bottleneck
- Part 1-C6 · 5 supply chain roles — SKH is the key upstream memory node
- Part 1-C7 · Business model — HBM cyclical high-margin vs. commodity
- Part 4-C6 · Samsung HBM failure case — Samsung missed HBM3E, gave SKH the opening
- Patterns — #7 picks-and-shovels · #6 cyclical
📚 SEC Primary Filings (look it up yourself)¶
- SK Hynix IR (English) — quarterly / annual reports + investor events
- Korea KOSPI DART filings (Korean + English) — all official filings
- TrendForce HBM market data — third-party industry data
Real-time quote: HXSCL OTC (CNBC) / Bloomberg HXSCL:US / Korea KOSPI 000660
Teaching use · numbers change — learn the method, not the specific figures · investment decisions are based on your own research + risk tolerance